Demands for advanced packaging services have surged as every smartphone is expected to be equipped with generative AI applications in the future. Taiwan Semiconductor Manufacturing Company (TSMC) ...
TL;DR: TSMC's 5nm and 3nm production lines are fully booked until mid-2025 due to high demand for AI, Qualcomm, and MediaTek chips. AI chip orders will keep 5nm lines over 100% utilized in early 2025.
SAN JOSE — A consortium of chip-equipment makers here today announced a major deal with Ace Semiconductor to help set up the world's first wafer-level packaging production line in China. Under the ...
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